| RoHS
Compliant |
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Several EU directives(
RoHS ,WEEE) are forcing manufactures to reduce respectively
to avoid the usage of hazardous subatances in electronic
devices. For this
reason, we guarantee that all products or parts intentionally
do not contain the hazardous substances prohibited by
RoHS directive : 2002/95/EC, SS-00259 Rev 4. |
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Several EU
directives (ROHS, WEEE (www.europa.eu.int/eur-lex/) are
forcing manufacturers to reduce respectively to avoid
the usage of hazardous substances in electronic devices.
For this reason we need
your cooperation and commitment with regard to the following
questions: |
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1.Which
lead free items can already be manufactured and delivered
by your company in compliance to ROHS? |
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a)
Please let us have your detailed list of the available
lead free items. |
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b)
How has the „lead free marking "been implemented? |
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Means |
lead-free
marking |
how
(description) |
| yes |
no |
| on
the label |
v |
|
Show
the lead free logo and RoHS complaint in the reel
and carton of label. |
| in
the article description |
v |
¡@ |
REMARK
FOR LEADFREE PRODUCT |
| in
the article number |
v |
¡@ |
FOR
LEAD FREE P/N + ¡§LF¡¨ |
| on
the packaging |
v |
|
LEAD
FREE PRODUCT LABEL FOR MARK OF LEAD FREE |
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2.
Do
you see any price and delivery changes for lead-free items
? |
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NO.If
so, which items? Please list them in detail. |
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3.
If your items are not yet lead free available, when will
you be definitely in the position of being able
to manufacture lead free items in compliance to ROHS? |
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>>Please let us have
your detailed roadmap including the way of your planned
„ lead free
marking¡§ >>question
1b. |
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4.
Are all your manufactured
items (lead free and not lead free) already solderable
with lead free soldering
processes
? |
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YES. |
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5.
Are all your lead free items
as well solderable with the
conventional Pb-soldering processes
? |
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YES. |
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6.
If you modify some processes in order to comply with the
RoHS directive, can you still fulfill the existing
specifications? |
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YES.>>If
not, please indicate what changes of specifications are
planned. |
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7.We
would like to receive all products according to the RoHS
directive commencing latest 30. April 2004. Can
you definitely fulfill this requirement? |
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YES.If
not, please. |
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a)
list all products that you deliver to us that will not
comply with the RoHS directive. |
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b)
what are the reasons. |
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c)
what measures are planned (e.g. compliance later date,
¡K). |
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8.
If you modify some processes
in order to comply with the RoHS directive, what measures
will be taken in order to guarantee the reliability
of the products? |
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SGS
REPORT. |
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Classification
Reflow Profiles |
|
 |
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| Profile
Feature |
Sn-Pb Eutectic Assembly |
Pb-Free Assembly |
| Large
Body |
Small
Body |
Large
Body |
Small
Body |
| Average
ramp-up rate(TL
to TP) |
3¢XC/second
max. |
3¢XC/second
max. |
| Preheat
-Temperature Min (Tsmin)
-Temperature Min (Tsmax)
-Time (min to max) (ts) |
100¢XC
150¢XC
60-120 seconds |
150¢XC
200¢XC
60-180 seconds |
| Tsmax
toTL
-Ramp-up Rate |
¡@ |
3¢J/second
max |
| Timemaintainedabove:
-Temperature (TL)
-Time (tL) |
183¢XC
60-150 seconds |
217¢XC
60-150 seconds |
| Peak
Temperature (Tp) |
225
+0/-5¢XC |
240
+0/-5¢XC |
245
+0/-5¢XC |
255
+5/-5¢XC |
| Time
within 5¢XC
of actual Peak
Temperature (tp) |
10-30
seconds |
10-30
seconds |
10-30
seconds |
20-40
seconds |
| Ramp-down
Rate |
6¢XC/second
max |
6¢XC/second
ma |
| Time
25¢XC
to Peak Temperature |
6 minutes max |
8 minutes max |
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Note : All
temperatures refer t topside of the package. Measured
on the package body surface. |
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Lable |
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 |
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 |
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OUTSIDE
CARTON LABEL |
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