SMD multilayer RF chip inductors are constructed using stacked ceramic (ferrite) layers to achieve miniature size, cost efficiency, and balanced electrical characteristics. Compared to wire-wound inductors, multilayer types provide a good balance of inductance, Q factor, current rating, and size. Thin-film chip inductors, built using micro-processing coil formation (Photolithography), offer extremely high Q and SRF with ultra-miniature dimensions down to 0603 (0.6×0.3 mm), making them ideal for RF matching and resonance circuits.

Multilayer & Thin-Film RF Inductor Technology

Multilayer RF inductors provide low cost and stable performance for RF matching, filter circuits, and wireless communication devices. Thin-film RF inductors offer superior Q factor, higher SRF, and tighter tolerance (±2%) thanks to precision photolithography. These inductors are widely used in smartphones, WLAN modules, Bluetooth devices, GPS units, and other portable electronics requiring compact RF components.

Key Characteristics

Characteristic

Stable RF performance
High Q factor & High SRF
Noise suppression capability (for chip beads)
Miniature dimensions suitable for compact layouts
Reliable multilayer ceramic structure

Features

• Ultra-miniature packages (as small as 0603)
• Multiple ferrite material options
• High SRF & excellent Q factor
• Cost-effective multilayer structure
• Suitable for reflow soldering & automated assembly

Applications

• RF modules, telecommunication systems
• Smartphones & handheld wireless devices
• Bluetooth, WLAN, GPS, and NFC circuits
• Computers & communication equipment
• Gaming devices, tablets, remote controllers
• Noise filtering for portable consumer electronics