Miniature, high-current multilayer ferrite inductors engineered for DC-DC converters, portable devices, and space-restricted power circuits.
* Other surface-mount miniature inductors you may also consider:
Need higher Q for RF filtering/tuning? → Multilayer RF Chip Inductors [URL: /en/category/CAT-Ceramic_Multilayer_Chip_Inductors.html]
Need GHz-class stable inductance for precision RF matching? → Thin-Film RF Chip Inductors [URL: /en/category/CAT-Ceramic_Thin_Film_Chip_Inductors.html]
Need EMI filtering on signal/power lines? → Multilayer Ferrite Chip Beads [URL: /en/category/CAT-Ferrite_Multilayer_Chip_Beads.html]
Need stronger magnetic shielding or significantly higher Isat? → Molded Power Inductors [URL: /products/molded-power-inductors]

Multilayer vs. Hot-Pressed Ferrite Technology (Manufacturing Comparison)

Two manufacturing technologies are used in compact ferrite power inductors: multilayer ceramic construction and hot-pressed ferrite technology. Hot-pressed types achieve higher inductance and greater freedom in customized geometries, while multilayer types remain ideal for ultra-compact footprints with stable characteristics. Coilmaster offers sizes from 0603 (1608) up to 1210 (3225) to satisfy different power density requirements.

High-Current Capability from Miniature Packages

Unlike traditional multilayer inductors that rely on printed internal conductors, Coilmaster's high-current series adopts copper internal wiring to improve saturation characteristics, reduce DCR, and withstand pulse or transient loads. This allows miniature inductors to deliver currents typically achievable only by larger wire-wound types.

Characteristic

* High saturation current (I
sat) and high Irms in compact SMD sizes.
Low DCR for improved conversion efficiency.
Stable inductance across load changes (High anti-saturation).
Ferrite core optimized for power applications.
Copper internal winding improves thermal handling and pulse reliability.
Available in 0603, 0805, 1008, 1210 sizes.
Excellent mechanical strength and reflow compatibility.
RoHS / REACH compliant.

Features

• Space-saving alternative to wire-wound inductors.
• Ideal for portable electronics and high-density PCB layouts.
• Enhanced transient-response performance in DC-DC converters.
• Supports fast-switching power ICs.
• Tight inductance tolerance for predictable power behavior.
• Strong anti-vibration and thermal robustness.

Applications

• Step-down / step-up DC-DC converters.
• Smartphones, tablets, wearable devices.
• Power rails for CPUs, PMICs, and IoT modules.
• High-density portable electronics.
• Battery-powered devices with limited PCB space.
• POL (Point-of-Load) regulators.
• LED drivers and low-voltage power stages.