High-Q multilayer ceramic RF inductors designed for impedance matching, LC filters, antenna tuning, and GHz-level wireless communication modules.
* If your circuit requires different RF filtering approaches:
Need even higher Q in ultra-miniature sizes? → Thin-Film RF Chip Inductors [URL: /en/category/CAT-Ceramic_Thin_Film_Chip_Inductors.html]
Need EMI suppression instead of precise L value? → Multilayer Ferrite Chip Beads [URL: /en/category/CAT-Ferrite_Multilayer_Chip_Beads.html]
Need high-current inductors for power conditioning? → Multilayer Ferrite Power Inductors [URL: /en/category/CAT-Multilayer_Ferrite_Chip_Inductors.html]
Need impedance transformation or RF front-end balancing? → SMD RF Balun Transformers [URL: /products/smd-rf-balun-transformers]

How Multilayer RF Inductors Perform in High-Frequency Circuits

Multilayer ceramic inductors provide stable inductance, low ESR, and strong SRF characteristics, making them ideal for matching networks, high-frequency filters, and resonant circuits operating from tens of MHz to GHz. Their precise inductance tolerance ensures predictable RF behavior in Bluetooth, Wi-Fi, GPS, and mobile communication systems.

Construction & Technology Advantage

Using multilayer ceramic fabrication, internal conductor traces are stacked to achieve repeatable inductance and consistent RF performance . Compared with wire-wound inductors, multilayer structures offer smaller size, affordable cost, and improved dimensional precision—crucial for high-density RF designs.

Characteristic

High Q factor for RF matching and resonant circuits
Stable performance up to GHz frequency range
Low ESR and low core loss ceramic material
Available in EIA 0201, 0402, 0603, 0805, 1206 sizes
Excellent SRF for wide-band RF applications
Tight inductance tolerance for precise RF tuning
Surface-mount construction compatible with high-temperature reflow
RoHS / REACH compliant, high reliability for mass production

Features

• Precise inductance for matching networks, antenna tuning, LC filters
• Suitable for compact wireless modules and high-density PCB layouts
• High Q and low DCR/ESR for efficient RF energy transfer
• Better dimensional control vs. wire-wound types
• Wide inductance range for RF design flexibility
• Excellent solderability with plated terminations
• Operating temperature −40°C to +125°C

Applications

• Bluetooth, Wi-Fi, WLAN, Zigbee, GPS, NFC modules
• Mobile phones, tablets, wearable devices
• RF matching and antenna tuning networks
• LC filters for high-frequency analog/RF circuits
• RF front-end modules, transceivers, IoT wireless nodes, LNA/PA matching networks
• Broadband amplifiers, oscillators, mixers
• Telecom equipment, baseband/RF interface circuits
• EMI reduction and signal conditioning at high frequency